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Capabilities
Location: Home > Capabilities
| PCB General Capability 2019 ‐ KINTON PRECISION ELECTRONICS CO.,LTD | ||
| Number of Layer | 1‐30Layer | |
| Maximum processing area | 500 x 1200 mm | |
| Min board Thickness | 1 Layer‐0.2mm | |
| 2 Layer‐0.2mm | ||
| 4 Layer ‐ 0.4mm | ||
| 6 Layer ‐ 0.6mm | ||
| 8 Layer ‐ 1.0mm | ||
| 10 Layer ‐ 1.1mm | ||
| 12 Layer ‐ 1.3mm | ||
| 14 Layer ‐ 1.5mm | ||
| 16 Layer ‐ 1.6mm | ||
| 18 Layer ‐ 1.8mm | ||
| Finished board thickness tolerance | Thickness＜1mm, Tolerance:+/‐0.1mm | |
| 1mm≤Thickness≤3mm,Tolerance+/‐10% | ||
| Twisting and bending | ≤0.75% (Advanced 0.5%) | |
| Range of TG | 130‐180℃ | |
| Impedance tolerance | Normal +/‐10%, advanced +/‐5% | |
| Hi‐Pot Test | Max4000V/10MA/60S | |
| Surface treatment | HASL With Lead , HASL Free Lead | |
| Flash Gold , Immersion Gold | ||
| Immersion Silver , Immersion Tin | ||
| Gold Finger , OSP | ||
| PCB Cu thickness +plating | ||
| Out layer Cu thickness | 1‐15 OZ | |
| Inner layer Cu thickness | 0.5‐6 OZ | |
| Cu thickness of PTH | IPC Class 2:average>=20um Min.>=18um | |
| Advanced: average>=25um Min.>=20um | ||
| HASL with lead | Tin 63% Lead37% | |
| HASL free lead | surface thickness 1‐40 um | |
| Thickness in the hole 1‐40 um | ||
| Flash Gold | Ni thickness:3‐5um (120u"‐160u") | |
| Immersion Gold | Ni thickness:3‐5um (120u"‐160u") | |
| Gold thickness: 0.025‐0.127um （1u"‐5u"） | ||
| Immersion Tin | Tin thickness:0.8‐1.2um（32u"‐48u"） | |
| Immersion silver | Ag thickness:0.15um‐0.75um (6u"‐30u") | |
| Gold Finger | Ni thickness:3‐5um（120u"‐160u"） | |
| Gold thickness:0.025‐1.51um（1u"‐60u"） | ||
| PCB Pattern limit Capability | ||
| Min width | 0.075mm (3 mil) for 1oz finished copper | |
| Min trace | 0.075mm (3 mil) for 1oz finished copper | |
| Min width of ring (inner layer) | 0.127mm (5 mil) | |
| Min width of ring (out layer) | 0.1mm (4 mil) | |
| Min solder bridge | 0.1mm (4 mil) for 1oz finished copper | |
| Min height of legend | 0.7mm (28mil) | |
| Min width of legend | 0.1mm (4 mil) | |
| PCB Holes processing Capability | ||
| Final hole size | Min 0.15mm by mechanical drill, 0.1mm by laser drill | |
| Drilling hole size | 0.15~6.5mm | |
| Drilling tolerance | +/‐0.05mm | |
| Final hole size tolerance (PTH) | φ0.150~5.0mm+/‐0.075mm | |
| Φ5.0~6.30mm: +/‐0.10mm | ||
| Final hole size tolerance (NPTH) | φ0.20~1.60mm+/‐0.05mm | |
| φ1.60~6.50mm: +/‐0.05mm | ||
| ≥6.51mm : +/-0.12mm | ||
| Maximum Aspect Ratio | 8:1 (Advanced 12:1) | |
| Min hole ring | 0.025mm | |
| PCB Cover thickness Capability | ||
| Solder mask Color | Green, Matte Green,Yellow, Blue, Red, Black, White | |
| Solder mask thickness | Surface line≥15um | |
| surface line corner≥10um | ||
| board laminate ≥20 | ||
| Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm | ||
| Legend Color | White, Yellow, Black | |
| Min height of legend | 0.70mm (28mil) | |
| Min width of legend | 0.1mm (4 mil) | |
| Blue Gel thickness | 0.2‐1.5mm | |
| Blue Gel tolerance | +/‐0.15mm | |
| Carbon print Thickness | 5‐25um | |
| Carbon print Min space | 0.25mm | |